N74F399D
vs
54F399M/B2AJC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SOIC
QLCC
Package Description
PLASTIC, SO-16
QCCN, LCC20,.35SQ
Pin Count
16
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
FOUR 2:1 MUX FOLLOWED BY REGISTER
FOUR 2:1 MUX FOLLOWED BY REGISTER
Family
F/FAST
F/FAST
JESD-30 Code
R-PDSO-G16
S-CQCC-N20
JESD-609 Code
e4
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
90000000 Hz
100000000 Hz
Max I(ol)
0.02 A
0.02 A
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
16
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
QCCN
Package Equivalence Code
SOP16,.25
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
34 mA
34 mA
Propagation Delay (tpd)
9 ns
11.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
90 MHz
80 MHz
Base Number Matches
4
1
kg CO2e/kg
12
Average Weight (mg)
356.15
CO2e (mg)
4273.8
Category CO2 Kg
12
Compliance Temperature Grade
Military: -55C to +125C
Length
8.885 mm
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
1.9 mm
Width
8.885 mm
Compare N74F399D with alternatives
Compare 54F399M/B2AJC with alternatives