N74F373DB
vs
N74F373DB,112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SSOP, SSOP20,.3
SSOP, SSOP20,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Logic IC Type
D LATCH
BUS DRIVER
Max I(ol)
0.024 A
0.024 A
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP20,.3
SSOP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
60 mA
60 mA
Prop. Delay@Nom-Sup
12 ns
8 ns
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Part Package Code
SSOP2
Pin Count
20
Manufacturer Package Code
SOT339-1
Family
F/FAST
JESD-609 Code
e4
Length
7.2 mm
Moisture Sensitivity Level
1
Number of Ports
2
Output Polarity
TRUE
Packing Method
TUBE
Propagation Delay (tpd)
8 ns
Qualification Status
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
Compare N74F373DB,112 with alternatives