N74F322N
vs
5962-8607401RA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
QP SEMICONDUCTOR INC
Package Description
DIP, DIP20,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T20
R-GDIP-T20
JESD-609 Code
e0
e0
Max Frequency@Nom-Sup
90000000 Hz
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
20
Count Direction
RIGHT
Family
F/FAST
Length
24.51 mm
Logic IC Type
PARALLEL IN PARALLEL OUT
Output Characteristics
3-STATE
Output Polarity
TRUE
Propagation Delay (tpd)
10 ns
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
70 MHz
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