Findchips: Compare N74F30D,623 vs 74F30D-T

N74F30D,623 vs 74F30D-T feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	PHILIPS COMPONENTS
Part Package Code	SOIC
Package Description	PLASTIC, SO-14	,
Pin Count	14
Manufacturer Package Code	SOT108-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	F/FAST	F/FAST
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4
Length	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.02 A
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	8	8
Number of Terminals	14	14
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Power Supply Current-Max (ICC)	4 mA	4 mA
Prop. Delay@Nom-Sup	5.5 ns
Propagation Delay (tpd)	5.5 ns	5 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.75 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	TTL	TTL
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	3.9 mm
Base Number Matches	1	2
	Logic » Gates	Logic » Gates