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N74F242D,623 vs MC74F240J feature comparison

N74F242D,623 NXP Semiconductors

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MC74F240J Motorola Mobility LLC

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP20,.3
Pin Count 14 20
Manufacturer Package Code SOT108-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G14 R-CDIP-T20
JESD-609 Code e4 e0
Length 8.65 mm 24.515 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 14 20
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 55 mA 75 mA
Propagation Delay (tpd) 4.5 ns 5.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Control Type ENABLE LOW
Max I(ol) 0.064 A
Package Equivalence Code DIP20,.3
Prop. Delay@Nom-Sup 8 ns
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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