N74F242D,623
vs
JM38510/33201BSA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
parentfamilyid
1076283
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SOIC
DFP
Package Description
SOP,
DFP,
Pin Count
14
20
Manufacturer Package Code
SOT108-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Category CO2 Kg
12.3
Compliance Temperature Grade
Commercial: +0C to +70C
EU RoHS Version
RoHS 2 (2011/65/EU)
EFUP
e
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V2.03
Additional Feature
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
Family
F/FAST
F/FAST
JESD-30 Code
R-PDSO-G14
R-GDFP-F20
JESD-609 Code
e4
Length
8.65 mm
12.7 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS TRANSCEIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Bits
4
6
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
14
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
55 mA
Propagation Delay (tpd)
4.5 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.16 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
6.475 mm
Base Number Matches
1
1
Package Equivalence Code
FL20,.3
Compare N74F242D,623 with alternatives
Compare JM38510/33201BSA with alternatives