N74F181N vs MC74F181N feature comparison

N74F181N NXP Semiconductors

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MC74F181N Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description DIP, PLASTIC, DIP-24
Pin Count 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T24 R-PDIP-T24
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type ARITHMETIC LOGIC UNIT ARITHMETIC LOGIC UNIT
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 65 mA 65 mA
Propagation Delay (tpd) 12.5 ns 14 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Length 31.69 mm
Package Equivalence Code DIP24,.3
Seated Height-Max 4.57 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare N74F181N with alternatives

Compare MC74F181N with alternatives