N74F157N
vs
MC54F157J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T16
R-GDIP-T16
Length
19.025 mm
19.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
23 mA
23 mA
Propagation Delay (tpd)
8.5 ns
12.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
4.19 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Pbfree Code
No
Rohs Code
No
Part Package Code
DIP
Pin Count
16
JESD-609 Code
e0
Max I(ol)
0.02 A
Prop. Delay@Nom-Sup
17 ns
Terminal Finish
TIN LEAD
Compare N74F157N with alternatives
Compare MC54F157J with alternatives