N74F157N vs MC54F157J feature comparison

N74F157N NXP Semiconductors

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MC54F157J Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 19.025 mm 19.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 23 mA 23 mA
Propagation Delay (tpd) 8.5 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 4.19 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Max I(ol) 0.02 A
Prop. Delay@Nom-Sup 17 ns
Terminal Finish TIN LEAD

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