N74ALS273DB
vs
74AHC273D,118
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SSOP,
7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
ALS
AHC
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
7.2 mm
12.8 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Power Supply Current-Max (ICC)
29 mA
Propagation Delay (tpd)
11 ns
21.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2.65 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
7.5 mm
fmax-Min
65 MHz
100 MHz
Base Number Matches
1
2
Rohs Code
Part Package Code
SOP
Pin Count
20
Manufacturer Package Code
SOT163-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP20,.4
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
14 ns
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare N74ALS273DB with alternatives
Compare 74AHC273D,118 with alternatives