N74ALS253DB-T vs 8509601EA feature comparison

N74ALS253DB-T NXP Semiconductors

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8509601EA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description SSOP, 0.300 INCH, CERAMIC, DIP-16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ALS ALS
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 6.2 mm 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Power Supply Current-Max (ICC) 12 mA 10 mA
Propagation Delay (tpd) 16 ns 30 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code No
Part Package Code DIP
Pin Count 16
ECCN Code EAR99
JESD-609 Code e0
Max I(ol) 0.012 A
Number of Bits 4
Package Equivalence Code DIP16,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 21 ns
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

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