N74ALS163BDB
vs
JM38510/38002BEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Package Description
SSOP,
CERAMIC, DIP-16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT
TCO OUTPUT
Count Direction
UP
UP
Family
ALS
ALS
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
Length
6.2 mm
19.56 mm
Load Capacitance (CL)
50 pF
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Power Supply Current-Max (ICC)
21 mA
21 mA
Propagation Delay (tpd)
16 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
7.62 mm
fmax-Min
100 MHz
22 MHz
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
ECCN Code
EAR99
JESD-609 Code
e0
Max I(ol)
0.008 A
Package Equivalence Code
DIP16,.3
Packing Method
TUBE
Prop. Delay@Nom-Sup
20 ns
Screening Level
MIL-M-38510 Class B
Terminal Finish
Tin/Lead (Sn/Pb)
Compare N74ALS163BDB with alternatives
Compare JM38510/38002BEA with alternatives