N7432N
vs
5962-9557401QCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
DEFENSE LOGISTICS AGENCY
Package Description
DIP, DIP14,.3
CERAMIC, DIP-14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
74
TTL/H/L
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.016 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
38 mA
Prop. Delay@Nom-Sup
22 ns
Propagation Delay (tpd)
22 ns
22 ns
Qualification Status
Not Qualified
Qualified
Schmitt Trigger
NO
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Length
19.56 mm
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
Compare N7432N with alternatives
Compare 5962-9557401QCA with alternatives