N7413N
vs
7413PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
74
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.016 A
0.016 A
Number of Functions
2
Number of Inputs
4
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
TOTEM POLE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
32 mA
32 mA
Prop. Delay@Nom-Sup
27 ns
27 ns
Propagation Delay (tpd)
27 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Rohs Code
Compare N7413N with alternatives