N25Q512A13G12A0E
vs
N25Q512A13G1240E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
TBGA,
TBGA, BGA24,5X5,40
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
108 MHz
108 MHz
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PBGA-B24
Length
8 mm
8 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX8
64MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA24,5X5,40
BGA24,5X5,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
QSPI
QSPI
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Pbfree Code
Samacsys Manufacturer
Micron
Data Retention Time-Min
20
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.0005 A
Supply Current-Max
0.015 mA
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare N25Q512A13G12A0E with alternatives
Compare N25Q512A13G1240E with alternatives