MXSMBJ8.5CA
vs
MXSMBJ8.5CAE3
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
SMBJ, 2 PIN
|
ROHS COMPLIANT, PLASTIC PACKAGE-2
|
Reach Compliance Code |
compliant
|
not_compliant
|
Breakdown Voltage-Max |
10.4 V
|
10.4 V
|
Breakdown Voltage-Min |
9.44 V
|
9.44 V
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
JEDEC-95 Code |
DO-214AA
|
DO-214AA
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
JESD-609 Code |
e0
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Non-rep Peak Rev Power Dis-Max |
600 W
|
600 W
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
Power Dissipation-Max |
1.38 W
|
1.38 W
|
Reference Standard |
IEC-61000-4-2, 4-4, 4-5; MIL-19500
|
MIL-19500
|
Rep Pk Reverse Voltage-Max |
8.5 V
|
8.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
AVALANCHE
|
AVALANCHE
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn) - annealed
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DO-214AA
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.50
|
Breakdown Voltage-Nom |
|
9.92 V
|
Clamping Voltage-Max |
|
14.4 V
|
Peak Reflow Temperature (Cel) |
|
250
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MXSMBJ8.5CA with alternatives
Compare MXSMBJ8.5CAE3 with alternatives