MXPLAD18KP8.0AE3 vs MAPLAD18KP8.0A feature comparison

MXPLAD18KP8.0AE3 Microchip Technology Inc

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MAPLAD18KP8.0A Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
Additional Feature HIGH RELIABILITY
Breakdown Voltage-Max 9.83 V
Breakdown Voltage-Min 8.89 V
Breakdown Voltage-Nom 9.36 V
Case Connection CATHODE
Clamping Voltage-Max 13.6 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code S-PSSO-G1
Non-rep Peak Rev Power Dis-Max 18000 W
Number of Elements 1
Number of Terminals 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style SMALL OUTLINE
Polarity UNIDIRECTIONAL
Power Dissipation-Max 2.5 W
Reference Standard AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-19500
Rep Pk Reverse Voltage-Max 8 V
Surface Mount YES
Technology AVALANCHE
Terminal Form GULL WING
Terminal Position SINGLE
Base Number Matches 2 2
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50

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