MXPLAD18KP170A vs MXLPLAD18KP170A feature comparison

MXPLAD18KP170A Microchip Technology Inc

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MXLPLAD18KP170A Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
Factory Lead Time 40 Weeks
Additional Feature HIGH RELIABILITY
Breakdown Voltage-Max 209 V
Breakdown Voltage-Min 189 V
Breakdown Voltage-Nom 199 V
Case Connection CATHODE
Clamping Voltage-Max 275 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code S-PSSO-G1
Non-rep Peak Rev Power Dis-Max 18000 W
Number of Elements 1
Number of Terminals 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style SMALL OUTLINE
Polarity UNIDIRECTIONAL
Power Dissipation-Max 2.5 W
Reference Standard AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-19500
Rep Pk Reverse Voltage-Max 170 V
Surface Mount YES
Technology AVALANCHE
Terminal Form GULL WING
Terminal Position SINGLE
Base Number Matches 2 2
Pbfree Code No
ECCN Code EAR99
HTS Code 8541.10.00.50

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