MXMLL6006CURE3TR vs BZT55B18L1 feature comparison

MXMLL6006CURE3TR Microsemi Corporation

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BZT55B18L1 Taiwan Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP TAIWAN SEMICONDUCTOR CO LTD
Part Package Code DO-213AA
Package Description O-LELF-R2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, LS34, QUADRO MINIMELF-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 18 V 18 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish MATTE TIN MATTE TIN OVER NICKEL
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 5 mA 5 mA
Base Number Matches 1 1
Dynamic Impedance-Max 50 Ω
Knee Impedance-Max 170 Ω
Moisture Sensitivity Level 1
Reverse Current-Max 0.1 µA
Reverse Test Voltage 13 V

Compare MXMLL6006CURE3TR with alternatives

Compare BZT55B18L1 with alternatives