MXMLL6000CUR-1 vs BZT55B10 feature comparison

MXMLL6000CUR-1 Microsemi Corporation

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BZT55B10 Taiwan Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP TAIWAN SEMICONDUCTOR CO LTD
Part Package Code DO-213AA
Package Description O-LELF-R2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AA
JESD-30 Code O-LELF-R2 O-GELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS CERAMIC, GLASS-SEALED
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 10 V 10 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD Matte Tin (Sn)
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 2% 2%
Working Test Current 5 mA 5 mA
Base Number Matches 1 5
Dynamic Impedance-Max 15 Ω
Knee Impedance-Max 70 Ω
Moisture Sensitivity Level 1
Reverse Current-Max 0.1 µA
Reverse Test Voltage 7.5 V

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