MXLSMBG9.0CA
vs
SMBG9.0CAHE3/52
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
VISHAY SEMICONDUCTORS
|
| Package Description |
PLASTIC, SMBG, 2 PIN
|
R-PDSO-G2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
HIGH RELIABILITY
|
EXCELLENT CLAMPING CAPABILITY, UL RECOGNIZED, HIGH RELIABILITY
|
| Breakdown Voltage-Max |
11.1 V
|
11.1 V
|
| Breakdown Voltage-Min |
10 V
|
10 V
|
| Breakdown Voltage-Nom |
10.55 V
|
10.55 V
|
| Clamping Voltage-Max |
15.4 V
|
15.4 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
DO-215AA
|
DO-215AA
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-G2
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Peak Rev Power Dis-Max |
600 W
|
600 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
1.38 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
9 V
|
9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
3
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-215AA
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reference Standard |
|
AEC-Q101; UL RECOGNIZED
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MXLSMBG9.0CA with alternatives
Compare SMBG9.0CAHE3/52 with alternatives