MXLPLAD18KP100CA
vs
MAPLAD18KP100CAE3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Base Number Matches
2
2
Factory Lead Time
40 Weeks
Additional Feature
HIGH RELIABILITY
Breakdown Voltage-Max
123 V
Breakdown Voltage-Min
111 V
Breakdown Voltage-Nom
117 V
Case Connection
CATHODE
Clamping Voltage-Max
162 V
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
S-PSSO-G1
Non-rep Peak Rev Power Dis-Max
18000 W
Number of Elements
1
Number of Terminals
1
Operating Temperature-Max
150 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
SQUARE
Package Style
SMALL OUTLINE
Polarity
BIDIRECTIONAL
Power Dissipation-Max
2.5 W
Reference Standard
AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-19500
Rep Pk Reverse Voltage-Max
100 V
Surface Mount
YES
Technology
AVALANCHE
Terminal Form
GULL WING
Terminal Position
SINGLE
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