MX7824TQ
vs
ADC08064BIJ
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP-24
DIP, DIP24,.3
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Analog Input Voltage-Max
5.25 V
6.1 V
Analog Input Voltage-Min
-0.1 V
Conversion Time-Max
2.8 µs
0.56 µs
Converter Type
ADC, FLASH METHOD
ADC, FLASH METHOD
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
Number of Analog In Channels
4
4
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Bit Code
COMPLEMENTARY OFFSET BINARY
BINARY
Output Format
PARALLEL, 8 BITS
PARALLEL, 8 BITS
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24(UNSPEC)
DIP24,.3
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Sample and Hold / Track and Hold
TRACK
SAMPLE
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
JESD-30 Code
R-GDIP-T24
Linearity Error-Max (EL)
0.2%
Package Shape
RECTANGULAR
Sample Rate
1.5 MHz
Seated Height-Max
4.572 mm
Supply Current-Max
20 mA
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare MX7824TQ with alternatives
Compare ADC08064BIJ with alternatives