MX7821KP-T
vs
AD7821TQ
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
PLASTIC, LCC-20
|
DIP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
2.5 V
|
2.5 V
|
| Analog Input Voltage-Min |
-2.5 V
|
-2.5 V
|
| Conversion Time-Max |
0.4 µs
|
0.66 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.965 mm
|
|
| Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
| Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
4.57 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.965 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Linearity Error-Max (EL) |
|
0.39%
|
| Peak Reflow Temperature (Cel) |
|
NOT APPLICABLE
|
| Sample Rate |
|
1 MHz
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT APPLICABLE
|
|
|
|
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