MX7821K/D vs MX7821TQ feature comparison

MX7821K/D Maxim Integrated Products

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MX7821TQ Maxim Integrated Products

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code DIE DIP
Package Description DIE-20 0.300 INCH, CERDIP-20
Pin Count 20 20
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 2.5 V 2.5 V
Analog Input Voltage-Min -2.5 V -2.5 V
Conversion Time-Max 0.875 µs 0.4 µs
Converter Type ADC, FLASH METHOD ADC, FLASH METHOD
JESD-30 Code R-XUUC-N20 R-GDIP-T20
JESD-609 Code e0 e0
Moisture Sensitivity Level 1 1
Negative Supply Voltage-Nom -5 V -5 V
Number of Analog In Channels 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Bit Code BINARY BINARY
Output Format PARALLEL, 8 BITS PARALLEL, 8 BITS
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Sample and Hold / Track and Hold TRACK TRACK
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 1
Length 26.16 mm
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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