MX7575BQ
vs
AD7575KP-REEL
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP-18
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
18
|
20
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
2.46 V
|
2.46 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
15 µs
|
15 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T18
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.1953%
|
0.3906%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Output Bit Code |
OFFSET BINARY
|
OFFSET BINARY
|
| Output Format |
SERIAL
|
PARALLEL, 8 BITS
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Length |
|
8.966 mm
|
| Package Equivalence Code |
|
LDCC20,.4SQ
|
| Seated Height-Max |
|
4.573 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
8.966 mm
|
|
|
|
Compare MX7575BQ with alternatives
Compare AD7575KP-REEL with alternatives