MX7545AKP+
vs
SP7545KCL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
API TECHNOLOGIES CORP
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
QCCJ,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, 2S COMPLEMENT BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e3
|
|
| Length |
8.9662 mm
|
8.9535 mm
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0244%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC20,.4SQ
|
LDCC20,.4SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Settling Time-Max |
1 µs
|
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.9662 mm
|
8.9535 mm
|
| Base Number Matches |
1
|
3
|
| Analog Output Voltage-Max |
|
15.3 V
|
| Analog Output Voltage-Min |
|
-0.3 V
|
| Settling Time-Nom (tstl) |
|
2 µs
|
|
|
|
Compare MX7545AKP+ with alternatives
Compare SP7545KCL with alternatives