MX7537LEWG
vs
MX7537KCWG
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15.4 mm
|
15.4 mm
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0122%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Settling Time-Nom (tstl) |
0.8 µs
|
0.8 µs
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
|
|
|