MX7537JP+
vs
AD7537KP
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
0.453 X 0.453 INCH, ROHS COMPLIANT, PLASTIC, LCC-28
|
PLASTIC, LCC-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.505 mm
|
11.5062 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0122%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
245
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Settling Time-Max |
1.5 µs
|
2 µs
|
| Settling Time-Nom (tstl) |
0.8 µs
|
0.8 µs
|
| Supply Current-Max |
2 mA
|
2 mA
|
| Supply Voltage-Nom |
15 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.505 mm
|
11.5062 mm
|
| Base Number Matches |
4
|
4
|
|
|
|
Compare MX7537JP+ with alternatives
Compare AD7537KP with alternatives