MX7535KN
vs
AD7535AQ
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog Output Voltage-Max |
10 V
|
|
| Analog Output Voltage-Min |
-10 V
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, WORD
|
|
| JESD-30 Code |
R-PDIP-T28
|
R-XDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
34.795 mm
|
|
| Linearity Error-Max (EL) |
0.0061%
|
0.012%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
4.572 mm
|
|
| Settling Time-Nom (tstl) |
0.8 µs
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP28,.6
|
| Settling Time-Max |
|
1.5 µs
|
| Supply Current-Max |
|
4 mA
|
|
|
|