MX7524KCSE+
vs
DAC-08CP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
0.150 INCH, ROHS COMPLIANT, SOIC-16
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
BINARY, OFFSET BINARY
OFFSET BINARY
Input Format
PARALLEL, 8 BITS
PARALLEL, 8 BITS
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e3
e0
Length
10.3 mm
21.755 mm
Linearity Error-Max (EL)
0.1953%
0.39%
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
5.08 mm
Settling Time-Max
0.5 µs
Supply Current-Max
2 mA
Supply Voltage-Nom
5 V
15 V
Surface Mount
YES
NO
Technology
CMOS
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
7.62 mm
Base Number Matches
2
4
Negative Supply Voltage-Nom
-15 V
Settling Time-Nom (tstl)
0.1 µs
Compare MX7524KCSE+ with alternatives
Compare DAC-08CP with alternatives