MX574AKP+T
vs
SP574BBL
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
SIPEX CORP
|
Part Package Code |
QLCC
|
|
Package Description |
QCCJ,
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
10 V
|
10 V
|
Analog Input Voltage-Min |
-10 V
|
-10 V
|
Conversion Time-Max |
25 µs
|
25 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
e0
|
Length |
11.505 mm
|
11.505 mm
|
Linearity Error-Max (EL) |
0.012%
|
0.0122%
|
Moisture Sensitivity Level |
1
|
|
Negative Supply Voltage-Nom |
-15 V
|
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Nom |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
11.505 mm
|
11.505 mm
|
Base Number Matches |
1
|
1
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Sample Rate |
|
0.04 MHz
|
Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
Compare MX574AKP+T with alternatives
Compare SP574BBL with alternatives