MX565ASD
vs
HI1-565ASD-2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
CERAMIC, DIP-24
DIP, DIP24,.6
Pin Count
24
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Analog Output Voltage-Max
10 V
10 V
Analog Output Voltage-Min
-10 V
-10 V
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
BINARY
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
Input Format
PARALLEL, WORD
PARALLEL, WORD
JESD-30 Code
R-GDIP-T24
R-CDIP-T24
JESD-609 Code
e0
e0
Linearity Error-Max (EL)
0.018%
0.018%
Negative Supply Voltage-Nom
-15 V
-15 V
Number of Bits
12
12
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Settling Time-Nom (tstl)
0.15 µs
0.35 µs
Supply Current-Max
20 mA
14.5 mA
Supply Voltage-Nom
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Settling Time-Max
1 µs
Compare MX565ASD with alternatives
Compare HI1-565ASD-2 with alternatives