MX52LM08A11XVI
vs
SDINBDG4-8G-I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
WESTERN DIGITAL CORP
Package Description
TFBGA, BGA153,14X14,20
,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
200 MHz
200 MHz
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B153
R-PBGA-B153
Length
13 mm
13 mm
Memory Density
68719476736 bit
68719476736 bit
Memory IC Type
FLASH CARD
FLASH CARD
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
153
153
Number of Words
8589934592 words
8589934592 words
Number of Words Code
8000000000
8000000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
8GX8
8GX8
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA153,14X14,20
BGA153,14X14,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3.3 V
Seated Height-Max
1 mm
0.8 mm
Supply Current-Max
0.045 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
MLC NAND TYPE
MLC NAND TYPE
Width
11.5 mm
11.5 mm
Base Number Matches
1
6
Data Retention Time-Min
1
Endurance
3000 Write/Erase Cycles
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