MX30KPA78CA vs 30KP78C-AP feature comparison

MX30KPA78CA Microsemi Corporation

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30KP78C-AP Micro Commercial Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS
Package Description PLASTIC PACKAGE-2 R-6, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Breakdown Voltage-Min 87.1 V 87.1 V
Case Connection ISOLATED ISOLATED
Clamping Voltage-Max 129 V 129 V
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-PALF-W2 O-PALF-W2
JESD-609 Code e0 e3
Moisture Sensitivity Level 1 1
Non-rep Peak Rev Power Dis-Max 30000 W 30000 W
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity BIDIRECTIONAL BIDIRECTIONAL
Power Dissipation-Max 1.61 W 8 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500 UL RECOGNIZED
Rep Pk Reverse Voltage-Max 78 V 78 V
Surface Mount NO NO
Technology AVALANCHE AVALANCHE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 4 2
Pbfree Code Yes
Breakdown Voltage-Max 95.4 V
Breakdown Voltage-Nom 91.3 V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 10

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Compare 30KP78C-AP with alternatives