MX30KPA60CAE3 vs 30KPA60C feature comparison

MX30KPA60CAE3 Microsemi Corporation

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30KPA60C Pulse Electronics Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP PULSE ELECTRONICS CORP
Package Description ROHS COMPLIANT, PLASTIC PACKAGE-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Breakdown Voltage-Min 67 V
Case Connection ISOLATED
Clamping Voltage-Max 102 V 102 V
Configuration SINGLE
Diode Element Material SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-PALF-W2 O-PALF-W2
JESD-609 Code e3
Moisture Sensitivity Level 1
Non-rep Peak Rev Power Dis-Max 30000 W
Number of Elements 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity BIDIRECTIONAL BIDIRECTIONAL
Power Dissipation-Max 1.61 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Rep Pk Reverse Voltage-Max 60 V 60 V
Surface Mount NO NO
Technology AVALANCHE
Terminal Finish MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 1 10
Breakdown Voltage-Nom 70.2 V

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