MX29LV640BBXEC-90G vs M29W640DB90ZA1T feature comparison

MX29LV640BBXEC-90G Macronix International Co Ltd

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M29W640DB90ZA1T STMicroelectronics

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD STMICROELECTRONICS
Part Package Code BGA BGA
Package Description TFBGA, BGA63,8X12,32 7 X 11 MM, 0.80 MM PITCH, TFBGA-63
Pin Count 63 63
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 12 mm 11 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 8,127
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.000015 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Type NOR TYPE NOR TYPE
Width 11 mm 7 mm
Base Number Matches 1 2
Additional Feature BOTTOM BOOT BLOCK

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