MX29GL512GLXFI-10GTR
vs
MT28EW512ABA1HPN-0SIT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MACRONIX INTERNATIONAL CO LTD
|
MICRON TECHNOLOGY INC
|
| Package Description |
LBGA,
|
VFBGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
100 ns
|
95 ns
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B56
|
| JESD-609 Code |
e1
|
|
| Length |
13 mm
|
9 mm
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
56
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
32MX16
|
32MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Seated Height-Max |
1.4 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
|
| Width |
11 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-04-22
|
| Samacsys Manufacturer |
|
Micron
|
|
|
|
Compare MX29GL512GLXFI-10GTR with alternatives
Compare MT28EW512ABA1HPN-0SIT with alternatives