MX29GL512GHXFI-10G
vs
S29GL512T10TFI010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
CYPRESS SEMICONDUCTOR CORP
Package Description
LBGA,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
12 Weeks
Access Time-Max
100 ns
100 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B64
R-PDSO-G56
JESD-609 Code
e1
e3
Length
13 mm
18.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
56
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
2.7 V
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Width
11 mm
14 mm
Base Number Matches
1
2
Boot Block
BOTTOM/TOP
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.06 mA
Type
NOR TYPE
Compare MX29GL512GHXFI-10G with alternatives
Compare S29GL512T10TFI010 with alternatives