MX28F640C3TXAC-90
vs
AM29BDS643DT9BWLI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DSBGA
Package Description
TFBGA,
Pin Count
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
JESD-30 Code
R-PBGA-B48
JESD-609 Code
e0
Length
12 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
48
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.75 mm
Terminal Position
BOTTOM
Width
11 mm
Base Number Matches
1
3
Compare MX28F640C3TXAC-90 with alternatives