MX27L256QC-20
vs
WS57C256F-70T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
STMICROELECTRONICS
Part Package Code
LCC
DIP
Package Description
QCCJ, LDCC32,.5X.6
WDIP, DIP28,.3
Pin Count
32
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
200 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J32
R-GDIP-T28
JESD-609 Code
e0
e0
Length
14.05 mm
37.085 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
WDIP
Package Equivalence Code
LDCC32,.5X.6
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
5.08 mm
Standby Current-Max
0.00001 A
0.0002 A
Supply Current-Max
0.01 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
7.62 mm
Base Number Matches
1
3
Compare MX27L256QC-20 with alternatives
Compare WS57C256F-70T with alternatives