MX26LV800TXBC-55G vs M29W800FT55ZA6T feature comparison

MX26LV800TXBC-55G Macronix International Co Ltd

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M29W800FT55ZA6T Micron Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,32 FBGA, BGA48,6X8,32
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Alternate Memory Width 8 8
Boot Block TOP TOP
Command User Interface YES YES
Data Polling YES YES
Endurance 2000 Write/Erase Cycles
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1,2,1,15 1,2,1,15
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA48,6X8,32 BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm
Sector Size 16K,8K,32K,64K 16K,8K,32K,64K
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.03 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 6 mm
Base Number Matches 1 2
Common Flash Interface YES

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