MX25L8005M2C-15
vs
KS24A641C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.3
DIP,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
33 MHz
0.4 MHz
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
Length
5.28 mm
9.2 mm
Memory Density
8388608 bit
65536 bit
Memory IC Type
FLASH
EEPROM
Memory Width
8
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1048576 words
65536 words
Number of Words Code
1000000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
1MX8
64KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
5.08 mm
Serial Bus Type
SPI
I2C
Standby Current-Max
0.00001 A
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
2 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
5.23 mm
7.62 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Write Cycle Time-Max (tWC)
5 ms
Compare MX25L8005M2C-15 with alternatives
Compare KS24A641C with alternatives