MX25L6406EXDI-12G
vs
W25Q64CVTCAG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
MACRONIX INTERNATIONAL CO LTD
WINBOND ELECTRONICS CORP
Package Description
TBGA, BGA24,5X5,40
TBGA, BGA24,4X6,40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
1
Clock Frequency-Max (fCLK)
86 MHz
80 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PBGA-B24
Length
8 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA24,5X5,40
BGA24,4X6,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3.3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00002 A
0.000005 A
Supply Current-Max
0.025 mA
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
24
Compare MX25L6406EXDI-12G with alternatives
Compare W25Q64CVTCAG with alternatives