MX25L1605AM2I-12G vs NX25P16VSI feature comparison

MX25L1605AM2I-12G Macronix International Co Ltd

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NX25P16VSI Winbond Electronics Corp

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MACRONIX INTERNATIONAL CO LTD WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP8,.3 SOP,
Pin Count 8 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 33 MHz 25 MHz
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-G8 S-PDSO-G8
Length 5.28 mm 5.27 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.3 SOP8,.3
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.015 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 5.23 mm 5.27 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Pbfree Code No
Data Retention Time-Min 20
JESD-609 Code e0
Terminal Finish TIN LEAD

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