MX1N5937BGTR vs BZX85C33T26R feature comparison

MX1N5937BGTR Microsemi Corporation

Buy Now Datasheet

BZX85C33T26R Texas Instruments

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DO-41
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-41
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.3 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 33 V 33 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 11.4 mA 8 mA
Base Number Matches 1 1
Knee Impedance-Max 2000 Ω
Reverse Current-Max 0.5 µA

Compare MX1N5937BGTR with alternatives

Compare BZX85C33T26R with alternatives