MX1N5281B-1 vs 1N5281B-1 feature comparison

MX1N5281B-1 Microsemi Corporation

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1N5281B-1 Microsemi Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-35 DO-35
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.48 W
Reference Standard MIL-19500
Reference Voltage-Nom 200 V 200 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 0.65 mA 0.65 mA
Base Number Matches 4 21
Dynamic Impedance-Max 2500 Ω
Qualification Status Not Qualified

Compare MX1N5281B-1 with alternatives

Compare 1N5281B-1 with alternatives