MX1N5263D-1E3TR vs JANTX1N979D-1 feature comparison

MX1N5263D-1E3TR Microsemi Corporation

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JANTX1N979D-1 Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code DO-35
Package Description O-LALF-W2 DO-35, 2 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.4 W
Qualification Status Not Qualified Qualified
Reference Voltage-Nom 56 V 56 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 1% 1%
Working Test Current 2.2 mA 2.2 mA
Base Number Matches 1 2
Factory Lead Time 52 Weeks
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 150 Ω
Knee Impedance-Max 2000 Ω
Moisture Sensitivity Level 1
Reference Standard MIL-19500
Reverse Current-Max 0.5 µA
Reverse Test Voltage 43 V
Voltage Temp Coeff-Max 53.76 mV/°C

Compare MX1N5263D-1E3TR with alternatives

Compare JANTX1N979D-1 with alternatives