MX1N5261D-1 vs 1N5261CUR-1TR feature comparison

MX1N5261D-1 Microsemi Corporation

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1N5261CUR-1TR Microsemi Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-35 DO-213AA
Package Description O-LALF-W2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED TR, 7 INCH; 2000
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-213AA
JESD-30 Code O-LALF-W2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.5 W
Reference Standard MIL-19500
Reference Voltage-Nom 47 V 47 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 1% 2%
Working Test Current 2.7 mA 2.7 mA
Base Number Matches 4 6
Moisture Sensitivity Level 1
Qualification Status Not Qualified

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Compare 1N5261CUR-1TR with alternatives