MX1N5261C-1
vs
1N5261C-B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICRO COMMERCIAL COMPONENTS
Part Package Code
DO-35
Package Description
O-LALF-W2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.5 W
Reference Standard
MIL-19500
Reference Voltage-Nom
47 V
47 V
Surface Mount
NO
NO
Technology
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
Terminal Position
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
2.7 mA
2.7 mA
Base Number Matches
1
2
Dynamic Impedance-Max
105 Ω
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare MX1N5261C-1 with alternatives
Compare 1N5261C-B with alternatives