MX1N5237C-1TR vs TC1N5237C.TB feature comparison

MX1N5237C-1TR Microsemi Corporation

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TC1N5237C.TB Tak Cheong Electronics (Holdings) Co Ltd

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code DO-35 DO-35
Package Description O-LALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 8.2 V 8.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 2% 2%
Working Test Current 20 mA 20 mA
Base Number Matches 1 1
Pbfree Code Yes
Dynamic Impedance-Max 8 Ω
Peak Reflow Temperature (Cel) 250

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